In part I, I talked about how to increase the thermal conductivity by putting some fillers inside your samples.
These days, people are more concern with "thermal resistance of boundaries."
The biggest issue might be the "undulation" of boundaries.
This undulation is the "air gap" between the boundaries and will cause thermal resistance.
Keeping this in your mind,
1. To decrease the thermal resistance, we must
2. Decrease the air gap and dissipate the heat.
3. To decrease the air gap, we should use heat dissipation sheet which is "flexible" and "adhesive."
As you noticed, if you want to measure the thermal diffusivity of this sample, you should not press down the sample too much. Since the sample is "flexible", the pressing might cause the deformation of the sample. (Of course, you might want to measure the thermal diffusivity of your sample as it is pressed)
If you use Thermowave Analyzer(TA), you do NOT need to press down the sample.
It can measure without any physical contact to your samples.
One another thing which I want to mention is that the structure of the sample I described above is multi-layer. You cannot find any literature data on multi-layer materials. Therefore, you might want to measure the actual thermal diffusivity on your own.
If you would like to do the testing service, please feel free to contact us.
eigyo@bethel.co.jp
Junichi
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